Adhesive thermal paste, glue type, 5g tube, white color

Adhesive thermal paste designed to securely attach a heat sink to various computer components such as chipsets or SSDs. It is not suitable for processors (CPUs)—for this purpose, we recommend our “Liquid Metal” product.

Use:

It provides effective heat dissipation by ensuring good thermal conduction between the component and the heat sink. Ideal for components that do not require a mechanical fastening system.

Technical characteristics:

Excellent resistance to heat, water, and acids.

Strong adhesion: allows for reliable fastening of the heat sink.

Composed of silicone grease: fluid but stable consistency (similar to heavy cream).

Supported temperature range: from -60°C to +300°C.

Thermal conductivity: greater than 0.671 W/m·K.

Packaging: 5 g tube (approximately the volume of an AAA battery).

Delivered in a sealed bag.