Cut-to-size thermal pad, conductivity 6W and thickness 1.5mm, 10x10cm

Heat-conductive silicone thermal pad designed to optimize the cooling of computer components. With a thermal conductivity of 6 W/m·K and a thickness of 1.5 mm, it is perfectly suited to the most demanding applications, such as CPUs, GPUs, SSDs, and other components with high heat dissipation.

Function:

This thermal pad acts as a thermal interface between the heat source (component) and the heat sink, housing, or external environment.

Thanks to its elastic and compressible structure, it effectively fills surface irregularities and gaps, ensuring optimal contact even on imperfect surfaces.

It helps maintain consistent performance of electronic components by preventing overheating that can cause slowdowns or failures.

Presentation:

Size: 10 x 10 cm.

Protected on both sides by a peelable film.

Can be cut to the desired dimensions.

Repositionable after application.

Technical characteristics:

Material: Thermal silicone.

Thermal conductivity 6 W/m·K.

Temperature range from -50°C to +200°C.

Dielectric strength 6 kV/mm.

Dimensions 100 x 100 mm.

Thickness 1.5 mm.