Kalea Informatique | IT specialist
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Thermal gel paste (non-adhesive) for computer components.
Use:
It allows for effective heat dissipation by ensuring good thermal conduction between the component and its heat sink.
Technical characteristics:
Thermal conductivity 12.8W/m.K.
Paste color: pink.
Composed of silica gel and ceramic powders.
Non-drying, insulating, can automatically fill free space.
Withstands compression.
Recommended thickness range: 0.08mm to 2.5mm.
High viscosity for easy application.
Packaging: 100g tube.
Delivered in a sealed bag.
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